BUILD YOUR OWN SEMICONDUCTOR WAFER
PAM-XIAMEN not only provides semiconductor wafers with SEMI standards but also provides wafers with unique specifications to meet customer needs.
We provide custom diameter wafers, thick wafers, thin wafers, DSP wafers, and other custom wafers.
Our Wafer Category
As a leading research and manufacturing company, we are dedicated to research and create CZ silicon wafer and ingot since1990, and then develop second-generation GaAs and InP wafer and the third-generation SiC and GaN wafer since 2004. Therefore our wafer range from SiC/GaN wafer, III-V wafer, and silicon wafer, including substrate and epitaxy.
GaN Wafer
Powerwaywafer is a leading GaN Wafer Manufacturer that offers wafers that can be in different thicknesses and orientations with polished or unpolished sides and can comprise dopants. GaN is a wideband gap material that provides her efficiency and power density than conventional semiconductors at the device level. The benefits include converting into size reduction, less power consumption, and affordable cost.
SiC Wafer
It is a next-generation semiconductor material typically and it features electrical properties and outstanding thermal properties. Most importantly, it is appropriate for high temperature and high power device applications. SiC is the best in extensive bandgap semiconductors as it can effortlessly dope p-type or n-type in the range of more than 5 orders of magnitude.
Epi Service
PAM-XIAMEN is the leading global manufacturer of epi wafer and material solutions servicing for the semiconductor industry, which we design structures and manufacture of compound semiconductor epitaxial wafers under epitaxy process. Our epi services are used in electronic and photonic device. As professional epi service Supplier China,
Semicundoctor Wafer
A semicundoctor wafer is usually a thin slice of semiconductor substance that is used widely used in electronics for the making of integrated circuits. It exists as an ASIC or an IC in every electronic device we use.
These wafers are a round piece of wafer that consists of the wafer die that performs a very specific functionally. They are the basic material for manufacturing electronic chips.
